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Heat Bed MOSFET Power Module

R 160.00

This MOSFET Power Module is a Heatbed Expansion module for isolating the main 3D Printer controller board

Out of stock

SKU: B0576 Categories: , ,
Description
Heated bed power module. Based on powerful MOSFET HA210NO6
Specifications
  • Size: 60*50mm
  • Mounting holes: 3.2mm diameter, for M3 screws.
  • Distance betweeen holes: 54*43mm
  • Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
  • Voltage: 12V-24V
  • Under the premise of normal cooling, it work stable under I(Max < Pulsed 50% duty cycle)=25A, the current must not exceed 25A while the process working (cooling required)
Weight 0.0 kg

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